Sample assembly for thermoelectric analyzer
US6791335B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 29, 2001 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/486
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a sample assembly for a thermoelectric analyzer, typically TSC (Thermally Stimulated Current) analyzer, a sample is fixed to an electrically-insulating substrate via an adhesive layer. The material of the adhesive layer is indium or gold-tin alloy. The substrate has a pair of junction electrode layers formed thereon and a pair of electrode layers formed on the same plane of the sample. One of the electrode layers is connected with one of the junction electrode layers by electrically-conductive wire, while the other of the electrode layers is connected with the other of the junction electrode layers by another electrically-conductive wire. The substrate is made of preferably made of a highly electrically-insulating and highly thermally-conductive material which may be, for example, aluminum nitride (AlN), boron nitride (BN), beryllium oxide (BeO) or aluminum oxide (Al2O3). The sample may preferably be a compound semiconductor such as GaAs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.