Electronic package
US6791832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jun 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package for providing an increased density of electronic components in systems includes electronic components mounted on two surfaces of a substrate. Electrical coupling is provided by electrical contacts mounted with substantially the same arrangement and number on both surfaces of the substrate. Two conductive substrates having apertures are mounted adjacent and substantially parallel to the two component mounting surfaces such that the electrical contacts mounted on the two surfaces protrude through the apertures of the two conductive substrates. The two conductive substrates are coupled to one or more heat sinks to conduct heat away from the multiple electronic components contained between the conductive substrates. Multiple electronic packages can be coupled together to form a stacked electronic package by physically connecting the electrical contacts of the electronic packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.