Jacek Budny
3Patents
3h-index
5Co-inventors
36Inventor score
Filing activity: Mar 26, 2002 → Mar 31, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6805560B1 | Apparatus interconnecting circuit board and mezzanine card or cards | Electricity | 25 | Expired |
| US7172432B2 | Stacked multiple connection module | Electricity | 13 | Expired |
| US6791832B2 | Electronic package | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.