Manufacturable optical connection assemblies
US6793407B2 · kind B2 · utility
6Cited by
30References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Mar 21, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.