Radial contact pad footprint and wiring for electrical components
US6793500B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and associated method comprising contact pads on a surface of a substrate for coupling signal, power, and ground connections for an electrical device to a plurality of conductive wires on the substrate. The contact pads are formed in single lines along radial edges of sectors on the substrate. Each of the sectors comprise a predetermined angle between the radial edges of each of the sectors. The plurality of sectors collectively form a circular area. The contact pads comprise signal, power, and ground connections located at predetermined positions on the single lines along the radial edges of each of the sectors on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.