Orbiting indexable belt polishing station for chemical mechanical polishing
US6793565B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Aug 24, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece.In another exemplary embodiment, an apparatus for planarizing a workpiece includes at least a first and a second polishing surfaces. The first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus also has a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface.In another exemplary embodiment, an apparatus for planarizing a workpiece includes a plurality of polishing stations. At least one of the polishing stations has a web with a first face which is positioned adjacent the workpiece during planarization. The apparatus also includes an orbiting assembly configured to orbit the web r…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.