Substrate processing apparatus
US6793769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Nov 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus injects gas from an injection port formed on a shielding surface of an atmosphere shielding part and sucks a substrate by Bernoulli effect. The substrate is sucked in a state coming into contact with a contact supporting surface of a support member provided on the atmosphere shielding part, and rotated with the upper surface shielded by a shielding surface of the shielding part. A solution supply part supplies a chemical solution to the lower surface of the substrate. Therefore, mist of a processing solution or the processing solution can be reliably prevented from reaching the upper surface of the substrate. Thus provided is a substrate processing apparatus capable of reliably preventing the mist of the processing solution or the processing solution from reaching the upper surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.