Electroplating methods including maintaining a determined electroplating voltage and related systems
US6793792B2 · kind B2 · utility
11Cited by
5References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | May 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for electroplating metal can include passing an electrical current through a conductive surface and an electroplating solution adjacent the conductive surface. An electroplating voltage for the conductive surface and the electroplating solution can be determined based on the electrical current through the conductive surface and the electroplating solution adjacent the conductive surface. The determined electroplating voltage can then be maintained while electroplating the metal from the electroplating solution on the conductive surface. Related systems are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.