Methods for fabricating a substrate
US6794276B2 · kind B2 · utility
92Cited by
5References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is provided for fabricating a substrate for optics, electronics, or optoelectronics. This method includes the steps of transferring a seed layer to a support layer, depositing a working layer onto the seed layer to form a composite substrate and detaching the working layer and the seed layer from the support to form a substrate. Advantageously, the support substrate comprises a material having a thermal expansion value of about 0.7 to 3 times the coefficient value of the working layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.