Integrated circuit interconnect
US6794760B1 · kind B1 · utility
6Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Sep 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system may include an integrated circuit die, a package, and an interconnect. The integrated circuit die may include a conductive die pad, the package may include a conductive package pad, and the interconnect may include two or more stranded wires. A first end of the interconnect is electrically coupled to the conductive die pad, and a second end of the interconnect is electrically coupled to the package pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.