Patent · US Expired

Method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design

US6795953B2 · kind B2 · utility

192Cited by
6References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 11, 2002
Grant dateSep 21, 2004
Priority date
Expiry dateSep 13, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F30/398
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design is described. Described processing includes retrieving conductivity layers information for an integrated circuit design from a GDSII formatted file; defining a dummy polygons layer and a target layer; restoring interconnect polygons from the conductivity layers information into the dummy polygons layer; copying the interconnect polygons from the dummy polygons layer to the target layer, except for dummy interconnect polygons; and performing defect analysis of the integrated circuit design using the target layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.