Method and device for producing a soldered joint
US6796483B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.