Alfred Kemper
9Patents
4h-index
8Co-inventors
42Inventor score
Filing activity: May 6, 2002 → Mar 21, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6796483B1 | Method and device for producing a soldered joint | Performing Operations; Transporting | 7 | Expired |
| US7525187B2 | Apparatus and method for connecting components | Electricity | 6 | Active |
| US6828600B2 | Power semiconductor module with ceramic substrate | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7555832B2 | Semiconductor chip attachment | Emerging Cross-Sectional Technologies | 4 | Active |
| US7793819B2 | Apparatus and method for connecting a component with a substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US7986034B2 | Power semiconductor module and method for producing the same | Electricity | 3 | Active |
| US7742843B2 | Method for the structured application of a laminatable film to a substrate for a semiconductor module | Electricity | 1 | Active |
| US8167187B2 | Method and device for producing a bondable area region on a carrier | Emerging Cross-Sectional Technologies | 1 | Active |
| US8698053B2 | Method for producing an electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.