Submount for opto-electronic module and packaging method using the same
US6796723B2 · kind B2 · utility
5Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Oct 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal is provided. The submount includes a dielectric material and an interconnection line. The dielectric material has a polygonal shape including a front face and a bottom face. The interconnection line is attached to the front face and the bottom face of the dielectric material. The interconnection line has a coplanar waveguide structure and is electrically to the opto-electronic device to output signals from the opto-electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.