Wear ring assembly
US6796887B2 · kind B2 · utility
5Cited by
32References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Nov 13, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wear ring assembly is provided for use in a workpiece (e.g. a semiconductor wafer) polishing apparatus. The wear ring assembly comprises a wear element and a backing ring. The backing ring includes a fulcrum and is configured to transfer a component of pressure applied to the backing ring to the wear element via the fulcrum. In this manner, a substantially uniform vertical displacement of the wear ring is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.