Metallurgically enhanced heat sink
US6797085B1 · kind B1 · utility
0Cited by
5References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 28, 2000 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Sep 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metallurgical process expands the grain structure in a heat sink from a fine grain to a coarse grain to improve the thermal conductivity of the heat sink. The temperature of the heat sink is raised to a level high enough to lead to a secondary re-crystallization grain growth in the metal alloy. The temperature of the heat sink is then gradually lowered to a cryogenic temperature and then immediately brought back up to ambient temperature to strengthen the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.