Method for reducing surface defects in an electrodeposition process
US6797144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for in-situ cleaning an electrodeposition surface following an electroplating process including providing a first electrode assembly and a second electrode assembly; applying a first current density across the first electrode assembly and the second electrode assembly for carrying out the electrodeposition process; carrying out the electrodeposition process to electrodeposit a metal onto an electrodeposition surface of the second electrode assembly; and, applying a second current density having a second polarity reversed with reference to the first polarity across the first electrode assembly and the second electrode assembly the second current density having a relatively lower current density compared to the first current density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.