Surface treating for micromachining and method for surface treatment
US6797194B1 · kind B1 · utility
2Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2000 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Dec 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a micromachining surface treatment material for and a surface treatment method that suppress widening of the diameter of contact holes when removing a natural oxidation layer arising at bottom sections of the contact holes. The micromachining surface treatment material contains less than 0.1% hydrofluoric acid, and more than 40% by weight but less than or equal to 47% by weight of ammonium fluoride. Also, a surfactant is contained therein in an amount from 0.0001 to 0.1% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.