Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board
US6797367B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 3, 2003 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Feb 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249994
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.