Shingetsu Yamada
10Patents
6h-index
18Co-inventors
59Inventor score
Filing activity: Aug 4, 1994 → Dec 2, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6228467A | Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6797367B2 | Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6499217B1 | Method of manufacturing three-dimensional printed wiring board | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7022399B2 | Semiconductor device integrated multilayer wiring board | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5441804A | Magneto-optical recording medium and method for production thereof | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6824884B2 | Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate | Emerging Cross-Sectional Technologies | 7 | Expired |
| US8742432B2 | Metal substrate and light source device | Electricity | 6 | Active |
| US7334324B2 | Method of manufacturing multilayer wiring board | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8169129B2 | Metal laminated body, LED-mounted substrate, and white film | Emerging Cross-Sectional Technologies | 2 | Active |
| US8044304B2 | Multilayer printed circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.