Die package for connection to a substrate
US6797882B1 · kind B1 · utility
9Cited by
2References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2001 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Oct 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.