Patent · US Expired

Lead frame, circuit board with lead frame, and method for producing the lead frame

US6798045B2 · kind B2 · utility

0Cited by

15References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Jens Pohl · San Luis Obispo, US
Simon Muff · Mering, DE
Eckehard Miersch · Holzgerlingen, DE

Key dates

Filing date	Jan 29, 2001
Grant date	Sep 28, 2004
Priority date	—
Expiry date	Jan 29, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame is described which has at least one integrated electronic circuit. The integrated electronic circuit is situated in a region of a main area of the lead frame. The lead frame has at least one signal line, at least one electrically insulating plate, and an electrically conductive, grounded plate are situated. The electrically insulating plate, and the electrically conductive, grounded plate are situated, at least in sections, between the integrated electronic circuit and the signal line. A method for producing the lead frame is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.