Flip chip assembly structure for semiconductor device and method of assembling therefor
US6798072B2 · kind B2 · utility
79Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jun 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.