Patent · US Expired

Condensation-based enhancement of particle removal by suction

US6799584B2 · kind B2 · utility

27Cited by

9References

43Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

David Yogev · Nesher, IL
Yoram Uzeil · Yodfat, IL
Lev Frisman · Zichron Ya'akov, IL
Amir Wachs · Haifa, IL

Key dates

Filing date	Nov 9, 2001
Grant date	Oct 5, 2004
Priority date	—
Expiry date	Jan 8, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S134/902
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these particles have a dimension of less than approximately one micron. A suction force is applied in the vicinity of the surface after applying the fluid so as to remove from the surface the majority of those particles having the dimension of less than approximately one micron.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.