Epoxy resin compositions, solid state devices encapsulated therewith and method
US6800373B2 · kind B2 · utility
73Cited by
6References
66Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Oct 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.