Thick film photoresists and methods for use thereof
US6800422B2 · kind B2 · utility
22Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.