Semiconductor manufacturing method and apparatus
US6800803B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2000 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus includes a leakage preventing device for preventing outward leakage of electromagnetic waves through an opening defined when a pod having a substrate accommodated therein is mounted on the semiconductor manufacturing apparatus. The leakage preventing device includes at least one electromagnetic wave shielding plate and is provided at the semiconductor manufacturing apparatus side. The apparatus also includes a first electromagnetic wave shielding plate, which is openable and closable so that an opening defined when a carrier in the standard mechanical interface pod is moved downwardly is closed by the plate, and a second electromagnetic wave shielding plate, which has an openable and closable slit provided between an indexer for moving the carrier in the standard mechanical interface pod downwardly and a conveyance robot for conveying the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.