Flexible tape electronics packaging
US6800947B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To decrease the weight and the thickness, and to increase the flexibility, of an electronics package, the package includes an integrated circuit (IC) mounted on a flexible tape substrate. In one embodiment, an IC is mounted on a flexible tape substrate using a ball grid array arrangement; however, other arrangements, including lead bonding, can be used. The flexible tape substrate can comprise conductive traces, vias, and patterns of lands on one or more layers. Methods of fabrication, as well as application of the flexible tape package to an electronic assembly, an electronic system, and a data processing system, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.