Ajit Sathe
14Patents
11h-index
18Co-inventors
61Inventor score
Filing activity: Sep 29, 2000 → Dec 18, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6840777B2 | Solderless electronics packaging | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6535386B2 | Electronic assembly having a heat pipe that conducts heat from a semiconductor die | Electricity | 40 | Expired |
| US6661660B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 36 | Expired |
| US6639799B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 28 | Expired |
| US6469893B1 | Direct heatpipe attachment to die using center point loading | Electricity | 23 | Expired |
| US6703697B2 | Electronic package design with improved power delivery performance | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7045890B2 | Heat spreader and stiffener having a stiffener extension | Electricity | 18 | Expired |
| US6625022B2 | Direct heatpipe attachment to die using center point loading | Electricity | 16 | Expired |
| US7253523B2 | Reworkable thermal interface material | Electricity | 16 | Expired |
| US6903278B2 | Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate | Electricity | 16 | Expired |
| US6800947B2 | Flexible tape electronics packaging | Electricity | 14 | Expired |
| US7159313B2 | Solderless electronics packaging and methods of manufacture | Emerging Cross-Sectional Technologies | 11 | Expired |
| US8952511B2 | Integrated circuit package having bottom-side stiffener | Emerging Cross-Sectional Technologies | 4 | Active |
| US7589395B2 | Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.