Procedure for encapsulation of electronic devices

US6803245B2 · kind B2 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• Institute of Materials Research and Engineering · SG

Inventors

• Mark Auch · Singapore, SG
• Ewald Guenther · Regenstauf, DE
• Chua Soo Jin · Singapore, SG

Key dates

• Filing date: Sep 28, 2001
• Grant date: Oct 12, 2004
• Expiry date: May 31, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/8426
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.