Optoelectronic semiconductor package device
US6803651B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2002 |
| Grant date | Oct 12, 2004 |
| Priority date | — |
| Expiry date | Feb 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/912
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor package device includes a semiconductor chip, an insulative housing and a conductive trace, wherein the chip includes an upper surface and a lower surface, the upper surface includes a light sensitive cell and a conductive pad, the insulative housing includes a first single-piece non-transparent insulative housing portion that contacts the lower surface and is spaced from the light sensitive cell and a second transparent insulative housing portion that contacts the first housing portion and the light sensitive cell, and the conductive trace extends outside the insulative housing and is electrically connected to the pad inside the insulative housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.