Patent · US Expired

Device and method for processing substrates

US6805754B1 · kind B1 · utility

4Cited by

7References

28Claims

0Family size

Assignee

Steag Micro Tech GmbH · DE

Inventors

Joachim Pokorny · Hüfingen, DE
Andreas Steinrücke · Lauffen am Neckar, DE

Key dates

Filing date	Sep 28, 2001
Grant date	Oct 19, 2004
Priority date	—
Expiry date	Sep 28, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/906
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.