Phosphono compound-containing polishing composition and method of using same
US6805812B2 · kind B2 · utility
6Cited by
10References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2001 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | May 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing system for a substrate comprising a liquid carrier, a polishing pad and/or an abrasive, a per-type oxidizer, and a phosphono group-containing additive, as well as a method of using the same to polish substrates, particularly nickel-containing substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.