Members for semiconductor manufacturing apparatus and method for producing the same
US6805968B2 · kind B2 · utility
6Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Dec 21, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/447
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A member for a semiconductor manufacturing apparatus comprises a steel substrate and a composite oxide film formed on a surface thereof and comprised of silicon oxide-aluminum oxide-chromium oxide and a sintering aid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.