Method and device for assessing surface uniformity of semiconductor device treated by CMP
US6806098B2 · kind B2 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention provides an inspection method and device which can efficiently measure the surface uniformity of a semiconductor device which is chemically and mechanically polished based on measured data at several points on the surface of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.