Molded end point detection window for chemical mechanical planarization
US6806100B1 · kind B1 · utility
14Cited by
3References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Dec 24, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An optical window structure for use in chemical mechanical planarization is provided. The optical window structure includes a polishing pad and an optical window opening in the polishing pad. The optical window structure also includes a molded optical window attached to an underside of the polishing pad, a molded portion of the optical window at least partially protruding into the optical window opening in the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.