Method of fabricating an air bridge
US6806181B2 · kind B2 · utility
2Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Mar 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protective pattern is formed on a semiconductor substrate in a shape covering a circuit region and exposing an air bridge connecting portion, a metallic film and an insulating film are formed to cover the protective pattern, the metallic film and the insulating film are patterned to form air bridge wiring and an air bridge protective film covering the air bridge wiring, and thereafter, the protective pattern is removed to form a hollow between the air bridge wiring and the circuit region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.