Patent · US Expired

POLY-O-HYDROXAMIDE, POLYBENZOXAZOLE, AND ELECTRONIC COMPONENT INCLUDING A DIELECTRIC HAVING A BARRIER EFFECT AGAINST COPPER DIFFUSION, AND PROCESSES FOR PREPARING POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, AND ELECTRONIC COMPONENTS

US6806344B2 · kind B2 · utility

3Cited by

6References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Recai Sezi · Simmerath, DE
Andreas Walter · Egloffstein, DE
Anna Maltenberger · Leutenbach, DE
Klaus Lowack · Erlangen, DE

Key dates

Filing date	Jun 27, 2003
Grant date	Oct 19, 2004
Priority date	—
Expiry date	Jun 27, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76801
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.