Patent · US Expired

Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two

US6806562B2 · kind B2 · utility

4Cited by

4References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Barchmann · Regensburg, DE
Erik Heinemann · Regensburg, DE
Josef Heitzer · Neutraubling, DE
Frank Pueschner · Kelheim, DE

Key dates

Filing date	Jan 25, 2002
Grant date	Oct 19, 2004
Priority date	—
Expiry date	Aug 9, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/209
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.