Method and apparatus for calibrating marking position in chip scale marker
US6808117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Jun 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.