Physically compact device package
US6809261B1 · kind B1 · utility
33Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.