Cheng Why Tan
14Patents
6h-index
21Co-inventors
62Inventor score
Filing activity: Jun 30, 1999 → Feb 28, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6809261B1 | Physically compact device package | Electricity | 33 | Expired |
| US6806583B2 | Light source | Electricity | 27 | Expired |
| US7612386B2 | High power light emitting diode device | Electricity | 16 | Active |
| US7385178B2 | Reflective encoders with various emitter-detector configurations | Physics | 11 | Expired |
| US7919787B2 | Semiconductor device with a light emitting semiconductor die | Electricity | 9 | Active |
| US6242280A | Method of interconnecting an electronic device | Electricity | 8 | Expired |
| US7745897B2 | Methods for packaging an image sensor and a packaged image sensor | Electricity | 6 | Active |
| US7102177B2 | Light-emitting diode incorporating gradient index element | Electricity | 6 | Expired |
| US7256486B2 | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same | Electricity | 6 | Expired |
| US7279355B2 | Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same | Electricity | 5 | Expired |
| US7495583B2 | Flat-top reflection-based optical encoders | Physics | 4 | Expired |
| US7114939B2 | Encapsulating brittle substrates using transfer molding | Performing Operations; Transporting | 1 | Expired |
| US9123869B2 | Semiconductor device with a light emitting semiconductor die | Electricity | 1 | Active |
| US7490771B2 | Reflective encoder with interchangable lens on emitter-detector module | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.