Flexible printed wiring board and its production method
US6809267B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Jan 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer adjacent thereto, holes A being provided in the insulating layer so as to reach the conductive layer, metal plugs being formed in these holes by an electrolytic plating method, metal bumps being produced by making the tips of these metal plugs project from the insulating layer. In this way, as many as possible flexible printed wiring boards can be obtained from a laminated sheet for flexible printed wiring of prescribed size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.