Circuitized substrate assembly and method of making same
US6809269B2 · kind B2 · utility
16Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Dec 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.