Patent assignee · US · COMPANY

Endicott Interconnect Technologies, Inc.

151Patents
97Active
151Granted
52Portfolio score

Filing activity: Dec 19, 2002 → Jun 14, 2012 · 90 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7800916B2 Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same Emerging Cross-Sectional Technologies 66 Active
US7142121B2 Radio frequency device for tracking goods Physics 66 Expired
US7292055B2 Interposer for use with test apparatus Electricity 56 Expired
US7508076B2 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers Electricity 53 Expired
US7595454B2 Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate Emerging Cross-Sectional Technologies 45 Active
US6995322B2 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same Emerging Cross-Sectional Technologies 43 Expired
US7841741B2 LED lighting assembly and lamp utilizing same Electricity 42 Active
US7025607B1 Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Electricity 27 Expired
US7501839B2 Interposer and test assembly for testing electronic devices Electricity 26 Active
US7294791B2 Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same Emerging Cross-Sectional Technologies 25 Expired
US6828514B2 High speed circuit board and method for fabrication Emerging Cross-Sectional Technologies 25 Expired
US7687722B2 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same Emerging Cross-Sectional Technologies 24 Active
US7738249B2 Circuitized substrate with internal cooling structure and electrical assembly utilizing same Emerging Cross-Sectional Technologies 23 Active
US7176383B2 Printed circuit board with low cross-talk noise Emerging Cross-Sectional Technologies 22 Expired
US6809269B2 Circuitized substrate assembly and method of making same Emerging Cross-Sectional Technologies 16 Expired
US7442879B2 Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate Electricity 15 Active
US7629684B2 Adjustable thickness thermal interposer and electronic package utilizing same Electricity 14 Active
US7541058B2 Method of making circuitized substrate with internal optical pathway Physics 14 Active
US7348677B2 Method of providing printed circuit board with conductive holes and board resulting therefrom Electricity 14 Active
US7791897B2 Multi-layer embedded capacitance and resistance substrate core Emerging Cross-Sectional Technologies 13 Active
US7261466B2 Imaging inspection apparatus with directional cooling Physics 13 Expired
US7293355B2 Apparatus and method for making circuitized substrates in a continuous manner Emerging Cross-Sectional Technologies 13 Expired
US8288857B2 Anti-tamper microchip package based on thermal nanofluids or fluids Electricity 13 Active
US7441709B2 Electronic card assembly Physics 13 Active
US7851906B2 Flexible circuit electronic package with standoffs Electricity 12 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.