Probe card for testing an integrated circuit
US6809539B2 · kind B2 · utility
14Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Jul 11, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card transmits high frequency signals between an integrated circuit under test and a semiconductor-testing device. The probe card includes a substrate, a signal transmission path formed on the substrate, a contactor formed on an end portion of the signal transmission path on one side of the substrate, a grounding conductor grounded, and a hole. The contactor is made of a metallic glass material, which shows a nature of viscous fluidity in the supercooled liquid region. The contactor is separated from the substrate over the hole. The contactor elastically contacts a pad of the circuit under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.