Planarization of substrates using electrochemical mechanical polishing
US6811680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jun 17, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.