Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
US6812060B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2000 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Apr 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/943
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces.A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 181 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.