Slurry for mechanical polishing (CMP) of metals and use thereof
US6812193B2 · kind B2 · utility
40Cited by
16References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Aug 30, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.