Apparatus and method for supplying chemicals in chemical mechanical polishing systems
US6814835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0971
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for supplying chemicals in a chemical mechanical polishing (CMP) process includes a plurality of chemical solution supply sources for supplying different chemical solutions in a pump-less manner by using a pressure applied at the chemical solution supply sources, each supply source having an associated feed line, re-circulating line, and means for measuring and controlling flow rates of the chemical solutions supplied through the feed lines. The chemical solutions are delivered via a plurality of delivery lines to a mixer, thereby providing a mixed chemical solution to a chemical injection part of a polishing apparatus. Each means for measuring and controlling flow rates is mounted in the feed lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.